JOB SUMMARY & RESPONSIBILITIES

• To provide process engineering support to manufacturing line and responsible for quality, yield, cost and cycle time of the products.

• Provide engineering support to manufacturing line in CIS iBGA line

• Job scope covers Die Attach / Die Bond process using epoxy dispensing at its core process.

• Responsible for process characterization and optimization, yield and quality improvement of assigned areas.

• To drive process improvement and perform other duties as required by immediate superior from time to time

• Beneficial if have experience in running Design of Experiment (DOE), able to analyze using JMP software or any background in Six Sigma knowledge

• Good teamwork and able to work under guidance and leadership of managers.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.