This job was posted by https://www.arjoblink.arkansas.gov : For more information, please see: https://www.arjoblink.arkansas.gov/jobs/4435988

Job Title: Electronics Packaging Engineer

Location: Fayetteville, AR\ Company: Ozark Integrated Circuits, Inc.

Position Overview:\ Ozark Integrated Circuits, Inc. (Ozark IC) is seeking a skilled, detail oriented, and motivated Electronics Packaging Engineer to join our manufacturing team. As a Packaging Engineer, you will be responsible for ceramic wiring board manufacturing, electronic board assembly, and testing. The ideal candidate will have hands-on experience in advanced microelectronic assembly techniques such as wire bonding and die attach, material science, and electronic packaging concepts. This role involves collaborating with cross-functional teams to support the design, production, and testing of high-quality electronic components and assemblies.

Key Responsibilities:

• Packaging Design: Design, develop, and optimize advanced electronic packaging solutions to meet product specifications and customer requirements.
• Collaboration: Work closely with the product development team to ensure packaging solutions align with product functionality and safety.
• Material Selection: Research and select appropriate materials for electronics manufacturing that balance performance, cost, and environmental impact. Collaborate with suppliers to source packaging materials and manage vendor relationships.
• Manufacturing: Support the design, development, and manufacturing of Ozark ICs ceramic wiring boards including process optimization and troubleshooting. Operate and maintain equipment needed for ceramic wiring board production. Perform quality control checks, including dimensional measurements and material evaluations, to ensure compliance with specifications. Develop and document process parameters, standard operating procedures, and production workflows.
• Electronics Packaging: Complete various electronics packaging tasks including die attach, component attach, and wire bonding using manual or automated equipment, ensuring proper placement and adhesion of bonds and components. Inspect bond integrity and ensure alignment with design specifications and industry standards. Troubleshoot bonding issues and recommend process improvements to enhance yield and reliability.
• Electronic Board Assembly and Test: Assemble final electronic systems/devices. Be familiar with inspection techniques to ensure void-free connections and robust thermal/electrical performance. Perform probing, functional testing, and troubleshooting of electronic assemblies to ensure performance and reliability. Collaborate with the team to address assembly issues, improve processes, and enhance productivity.
• Process Optimization: Evaluate and improve existing packaging processes, focusing on efficiency, quality, and sustainability. JMP or Minitab experience is a plus.
• Equipment Maintenance and Calibration: Perform routine maintenance, calibration, and repair of ceramics production and electronics assembly equipment to ensure optimal performance. Coordinate with vendors or service providers for specialized repairs or upgrades as needed.
• Documentation and Reporting: Maintain detailed records of process parameters, test results, and production data. Prepare technical reports and contribute to continuous improvement initiatives. Support training and knowledge sharing with team members on ceramics and assembly processes.
• Device Qualification and Quality Assurance: Develop and implement testing protocols to ensure packaging durability and reliability under various environmental conditions and to meet qualification st ndards for designated customers.

Suggested Qualifications:

• Bachelor\'s degree in Engineering (Mechanical, Electrical, Materials Science)
• A diploma or certificate in microelectronics or electronics assembly is a plus.

{=html} <!-- --> - Proven experience in packaging design, engineering, or a similar role (1-3 years preferred). - Knowledge of electronic packaging materials, manufacturing processes, and testing methodologies. - Familiarity with regulatory standards and industry guidelines related to electronics and packaging. - Excellent problem-solving and analytical skills. - Strong communication skills and the ability to work effectively in a team-oriented environment.

Preferred Skills:

• Experience with CAD/3D modeling and simulation tools such as SolidWorks, ANSYS, or Comsol.
• Experience with electronics packaging automation and equipment, i.e dispensing, pick and place, and wire bonding.

{=html} <!-- --> - Strong knowledge of ceramics/printed circuit board fabrication, microelectronics assembly, and related quality standards (e.g., IPC, MIL-STD).

Knowledge of materials and t