Sr Staff ASIC (IC) Engineer [HPC AI]

Job Description

Design  

• Perform RTL design, synthesis, and optimization for timing, area, and power to meet IP specifications and requirements.

• Work closely with system/ASIC architects to understand system requirements and contribute to architectural decisions.

• Work with system and software teams on pre-silicon FPGA verification.

Verification

• Develop and maintain verification environment for IP modules and SoC level using UVM methodology.

• Perform front-end verification using UVM methodology.

Common

• Support system and software team on post silicon evaluation.

• Continual design automation for better efficiency.

Qualifications

Qualifications  

• Bachelor's or Master's degree in Computer Engineering, Electrical Engineering, or related field. Ph.D is a plus.

• 5 years or above of experience in digital IC design and/or verification; staff level will be considered for those with more years of experience.

• Experience with full digital design cycle is a must; synthesis/STA/CDC/lint.

• Fluent with Verilog/VHDL is a must.

• Fluent with SystemVerilog and UVM verification methodology.

• Good knowledge of scripting (Bash / Perl / Python / TCL) for design automation.

• Good knowledge of timing, DFT and power structure.

• Good knowledge of AMBA bus infrastructure (ACE/AXI/AHB).

Preferences  

• Experience with GPU/NPU/TPU design is highly preferred.

• Experience with CPU processor design is a plus.

• Experience with hardware emulator (ZeBu/Palladium/Veloce) is a plus.

• Experience with HLS (e.g. Catapult/Stratus) is a plus.

• Knowledge of cache design is a plus.

• Knowledge of memory systems and cache coherency protocol is a plus.

• Knowledge of embedded programming using C/C++ language is a plus.

• Knowledge of synthesis for FPGA is a plus.

• Knowledge of bare-metal CPU (ARM/RISCV) bring-up is a plus.

Company Description

ASIC Design Engineer (AI Sub-system)

Overview 

We are seeking a talented and motivated ASIC Design Engineer (AI Sub-system) to join our R&D team to own, define, and drive exploration and design of the next generation hardware for AI sub-system in high performance computing (HPC) SoCs. We are looking for candidates who are comfortable taking up both design and verification roles.

Our division’s mission is to use the latest AI and cloud technologies to develop the best AI inference for advanced driver safety engineers building self-driving vehicles and other high performance compute products. Renesas is the leading automotive electronics supplier globally, and this is a rare opportunity to develop the infrastructure required to deploy our AI software to the billions of devices we ship to customers every year. You will join our newly formed AI & Cloud Engineering organization of around 100 software engineers. Due to strong demand for our AI-related products we are planning to triple in size in the next three years, so there is lots of room for you to help us grow the team together while remaining small. Our team’s key locations are Tokyo, London, Paris, Dusseldorf, Beijing, Singapore, Ho Chi Minh City, and other metropolitan areas, but you can also join fully remotely from other locations globally or get our support to relocate to our key hubs such as Tokyo.  

Additional Information

Renesas Electronics Corporation (TSE: 6723 (http://www.jpx.co.jp/english/) ) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at  renesas.com . Follow us on LinkedIn (https://www.linkedin.com/company/renesas/) , Facebook (https://www.facebook.com/RenesasElectronics/) , Twitter (https://twitter.com/renesasglobal) , YouTube (https://www.youtube.com/user/RenesasPresents) , and Instagram (https://www.instagram.com/renesas_global/) .  

Renesas’ mission, To Make Our Lives Easier, is underpinned by our company culture, TAGIE. TAGIE stands for Transparent, Agile, Global, Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues, customers and stakeholders.  

We are committed to creating a diverse culture where everyone is included and feels a sense of belonging. For more information, please read our Diversity & Inclusion Statement (https://www.renesas.com/us/en/about/company/sustainability/diversity) .  

Renesas Electronics Corporation empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at www.renesas.com .

Renesas’ mission, To Make Our Lives Easier, is underpinned by our company culture, TAGIE. TAGIE stands for Transparent, Agile, Global, Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues, customers and stakeholders.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement (https://www.renesas.com/kr/en/about/company/sustainability/diversity) .

1. Department Manufacturing

2. Location Beijing

3. Remote No

Requisition ID

20011759_2024-07-05

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