Embedded Software Engineer (C/C++)

Job Description

1. Participate and lead in the software architecture design of the runtime software across multi-device and heterogeneity.

2. Apply code optimization techniques, ensuring efficient and optimized performance of the runtime software components.

3. Deliver architecture specifications to developers and articulate them effectively across stakeholders ranging from toolchain, system and hardware teams, and to technology leadership.

4. Collaborate with silicon and platform bring-up to verify and debug the AI sub-system and its delivered performance.

Qualifications

Qualifications 

1. Bachelor's or Master's degree in Computer Engineering, Electrical Engineering, or related field; Ph.D. is a plus.

2. 10 years of embedded software design and development on SoCs and/or ASICs.

3. Great coding skills in C/C++.

4. Great knowledge of SW architectural patterns (layered/plugin/event-driven/ microkernel/etc).

5. Good knowledge of SDLC.

6. Good knowledge of RTOS and/or Linux OS.

7. Good knowledge of multi-thread and multi-process software design and debugging.

8. Experience with embedded system involving multi-core CPU/DSP.

9. Experience with heterogeneous multi-device system involving GPU/NPU/FPGA.

10. Knowledge of debuggers (LLDB, GDB) and profilers on heterogeneous hardware system.

Preferences 

1. Experience with Python is a plus.

2. Experience with ARM and/or RISCV ISA is a plus.

3. Knowledge of Linux kernel and driver development is a plus.

4. Knowledge of CNN and common NN operators/layers like Conv2D, BatchNorm, etc is a plus.

5. Knowledge of internal of inference engines like TFLite, OpenVINO runtime, ONNX runtime, TVM runtime, etc is a plus.

6. Knowledge of JTAG debugger and bare-metal bring-up is a plus.

7. Knowledge of high performance domain-specific languages (SYCL/CUDA/OpenCL) is a plus.

8. Knowledge of PyTorch or TensorFlow is a plus.

9. Knowledge of just-in-time compilation techniques is a plus.

Company Description

Overview

We are seeking a talented and motivated Software Architect (AI Sub-system) to join our R&D team to own, define, and drive exploration and design of our next generation runtime software involving multi heterogeneous devices in high performance computing (HPC) SoCs.

Our division’s mission is to use the latest AI and cloud technologies to develop the best AI inference for advanced driver safety engineers building self-driving vehicles and other high performance compute products. Renesas is the leading automotive electronics supplier globally, and this is a rare opportunity to develop the infrastructure required to deploy our AI software to the billions of devices we ship to customers every year. You will join our newly formed AI & Cloud Engineering organization of around 100 software engineers. Due to strong demand for our AI-related products we are planning to triple in size in the next three years, so there is lots of room for you to help us grow the team together while remaining small. Our team’s key locations are Tokyo, London, Paris, Dusseldorf, Beijing, Singapore, Ho Chi Minh City, and other metropolitan areas, but you can also join fully remotely from other locations globally or get our support to relocate to our key hubs such as Tokyo. 

Additional Information

Renesas Electronics Corporation (TSE: 6723 (http://www.jpx.co.jp/english/) ) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at  renesas.com . Follow us on LinkedIn (https://www.linkedin.com/company/renesas/) , Facebook (https://www.facebook.com/RenesasElectronics/) , Twitter (https://twitter.com/renesasglobal) , YouTube (https://www.youtube.com/user/RenesasPresents) , and Instagram (https://www.instagram.com/renesas_global/) . 

Renesas’ mission, To Make Our Lives Easier, is underpinned by our company culture, TAGIE. TAGIE stands for Transparent, Agile, Global, Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues, customers and stakeholders. 

We are committed to creating a diverse culture where everyone is included and feels a sense of belonging. For more information, please read our Diversity & Inclusion Statement (https://www.renesas.com/us/en/about/company/sustainability/diversity) . 

Renesas Electronics Corporation empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at www.renesas.com .

Renesas’ mission, To Make Our Lives Easier, is underpinned by our company culture, TAGIE. TAGIE stands for Transparent, Agile, Global, Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues, customers and stakeholders.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement (https://www.renesas.com/kr/en/about/company/sustainability/diversity) .

1. Department Manufacturing

2. Location Beijing

3. Remote No

Requisition ID

20011765_2024-07-05

Apply

Shortlist