Job Information
Sandisk [July Onwards Intake ONLY] Internship - Package Integration Engineering in Batu Kawan, Malaysia
Company Description
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Job Description
ESSENTIAL DUTIES AND RESPONSIBILITIES:
You will work as intern role in Assembly PIE (packaging integration engineering) Team. Major focus on new product packaging development and support PIE team on new product development activity.
During support PIE on new product Package development, performance monitor and system maintenance will be key focus:
Work closely with both internal team and cooperate team on product yield tracking and drive for yield improvement.
Setup new product assembly process flow and manage new product BOM.
Prepare product design DOE material and monitor progress
Maintain new product related system and enhance function
Qualifications
REQUIRED:
Bachelor or Master Students major in Computer Science, Material Science, Mechanical Engineering or other engineering areas
Interested on Packaging engineering R&D and data analysis
PREFERRED:
Prefer to have some experience on one programming language such as Python, Java, C+, Swift etc
Self-motivated and self-directed.
SKILLS:
Strong work ethic, capable of performing effectively under high-pressure situations, and maintaining composure in the face of uncertainties.
Exceptional problem-solving skills with expertise in experimental design and statistical analysis.
Excellent communication skills, enabling collaboration with global functional teams
Additional Information
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@wdc.com (staffingsupport@wdc.com) to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to compliance@wdc.com.